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Indian Trade Secretary: India will need more imports to maintain high growth, and should not be too worried about the trade deficit.The 10-year main contract of treasury bond futures rose in the afternoon, hitting a record high. The 10-year main contract of treasury bond futures rose in the afternoon and now rose by 0.17% to 108.335 yuan, hitting a record high. In addition, the 30-year main contract rose by 0.27%, the 5-year main contract rose by 0.07%, and the 2-year main contract rose by 0.03%.An earthquake of magnitude 4.0 occurred in the waters near the Fukushima Daiichi nuclear power plant in Japan. According to Japanese media reports, an earthquake of magnitude 4.0 occurred on the morning of the 12th local time in the eastern coastal area of Fukushima Prefecture, Japan, with a focal depth of 50 kilometers. Fukushima Prefecture has a sense of earthquake in many places, including Urachi-CHO, Langjiang-CHO and Yuye-CHO, among which Urachi is the location of Units 1 to 4 of the Fukushima Daiichi nuclear power plant. (CCTV News)

Institution: The battery price stabilized in November, and it is expected to rise slightly in 2025. On December 12, according to the latest research of TrendForce Jibang Consulting, in November 2024, the sales of electric vehicles in China continued to increase, which boosted the demand for power batteries, and the price of Ferrous lithium phosphate batteries remained stable, while the ternary batteries declined slightly. The demand for batteries in the energy storage market maintained the peak season characteristics, and with the price advantage of large-capacity batteries, the proportion of shipments increased. However, the average price of energy storage batteries continued to decline in November due to the slowdown in demand for orders at the end of the year. The agency expects that the price of some lithium battery materials may rise slightly in the peak season of 2025, which is expected to repair the serious losses of the company in the early stage. However, due to the fact that the relationship between supply and demand has not changed from surplus to shortage, the expected increase in material prices is limited, and battery manufacturers actively control costs, the battery price trend will be stable next year.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)It is reported that NVIDIA has increased its recruitment in China, and it is expected to add 1,000 employees this year. According to people familiar with the matter, NVIDIA has increased its recruitment in China this year to enhance its research ability and focus on new autonomous driving technology. According to sources, the company is expected to have about 4,000 employees in China by the end of this year, compared with about 3,000 at the beginning of this year. As a key part of the expansion, NVIDIA added about 200 employees in Beijing to strengthen a research team engaged in autonomous driving research. One person familiar with the matter said that the company has also expanded its after-sales service and network software development team.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Renhe Pharmaceutical invested in Jiangxi to establish a health industry company. According to the enterprise search APP, Jiangxi Renhe Jiuniuai Health Industry Co., Ltd. was recently established, with Xin Li as the legal representative and a registered capital of 1 million yuan. Its business scope includes: food Internet sales, health food production, health care services (non-medical), health consulting services, sales of first-class medical devices, sales of agricultural and sideline products, etc. Enterprise survey shows that the company is jointly held by Renhe Pharmaceutical and Xin Li.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)